1. 2. 3. material content data sheet sales product name sab-c161pi-lm ca issued 29. august 2013 ma# MA000733216 package pg-mqfp-100-2 weight* 1786.95 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 16.055 0.90 0.90 8985 8985 leadframe non noble metal magnesium 7439-95-4 0.538 0.03 301 inorganic material silicon 7440-21-3 2.331 0.13 1304 non noble metal nickel 7440-02-0 10.756 0.60 6019 non noble metal copper 7440-50-8 344.917 19.30 20.06 193020 200644 wire noble metal gold 7440-57-5 3.785 0.21 0.21 2118 2118 encapsulation organic material carbon black 1333-86-4 6.917 0.39 3871 plastics epoxy resin - 200.582 11.22 112248 inorganic material silicondioxide 60676-86-0 1175.827 65.82 77.43 658006 774125 leadfinish non noble metal tin 7440-31-5 19.520 1.09 1.09 10924 10924 plating noble metal silver 7440-22-4 1.857 0.10 0.10 1039 1039 glue plastics epoxy resin - 0.967 0.05 541 noble metal silver 7440-22-4 2.901 0.16 0.21 1624 2165 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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